B200

The SuperX B200 is engineered for peak AI performance, equipped with 8 NVIDIA® Blackwell B200 GPUs connected with 5th-Gen NVLink, 1,440 GB of ultra-fast HBM3E memory, and powerful 6th-Gen Intel® Xeon® processors - delivering exceptional AI performance in a compact 10U form factor.

Highlights

Performance Architecture

  • Based on 6th Gen Intel® Xeon® Scalable Processors, up to 350 W TDP
  • 32 DIMM slots supporting RDIMM up to 6400 MT/s, MRDIMMs up to 8000 MT/s

Flexible Configuration

  • CPU to Switch flexible link bandwidth (X16 or X32)
  • Supports full-height and half-height NIC cards

For New Data Center

  • Supports front IO access
  • N+N PSU Redundant
  • High-efficiency thermal solution for power saving
  • High-efficiency DC/DC solution

Technical Specifications

XN8160-B200|0|1|40%,60%
System Dimension ·8U|·447x351x923mm(L*W*H)
CPU ·Intel@ Xeon@6 Processors |Intel@Xeon@6700-Series Processors |Intel@Xeon@6500-Series Prcessorss |· Dual processor, TDP up to 350W
Socket ·2xLGA 4710 |·Socket E2
Chipset System on Chip
Security ·UEFI Secure Boot |·SNMP Support:V3
Memory ·32 x DIMM slots |·DDR5 memory supported |·8-channel memory per processor |·RDIMM: Up to 6400 MT/s (1DPC). 5200 MT/s (2DPC) |·MRDIMM: Up to 8000 MT/s
LAN Front(I/O board-CFPG440): |·2x10Gb/s LAN(1x Intel@X710-AT2) Support NCSI functicn |·1x10/100/1000 Mbps Management LAN Rear (MLAN board-CDB66): |·1x10/100/1000 Mbps Management LAN
Video ·Integrated in Aspeed@AST2600 |1xVGA port
Storage Front hot-swap: |·8x2.5" Gen5 NVMe |(NVMe from PEX89104) | |Internal M.2: |·1xM.2(2280/22110) ,PCIe Gen5 x 4,from CPU 1 |·1xM.2(2280/22110), PCIe Gen5 x 2,from CPU 1
GPU NVIDIA HGX'" B200 with 8 x SXM GPUs
Expansion Slot ·PCIe Bridge Board-CBG76: |8xFHHLx16 (Gen5x16), from PEX89104 |·PCIe Bridge Board-CBG045x2: |4xFHHLx16(Gen5x16), from PEX89048
Front I/O I/O board-CFG404: |·2xUSB 3.2 Gen1 ports(Type-A) |·1xVGA port |·2xRJ45 ports |·1xMLAN port (default) |·1xPower button with LED |·1xID button with LED |·1xNMI button |·1xRest button |·1xStorage activity LED |·1xSystem status LED
Rear I/O MLAN board-CDB66: |·1xMLAN port
Power Supply ·6+6 3000W 80 PLUS Tilanium redundant |power supplies [1] |[1]The system power supply requires C19 power cord
XN8161-B200|0|1|40%,60%
Form Factor 8U Rackmount
Dimension 930x448x353.6mm(36.6"x17.6" x13.9")
Button Power button w/LED,reset button, |NMI button,UID button
LED System fault LED,hard drive activity LED
I/O Port ·2 RJ45 (1GbE) by Intel®i350,share with rear I/O |·1 Dedicated IPMI, shares with rear I/O |·4 Type-A(USB3.2 Gen1) |·1 DB15(VGA)
Front Side Drive Bay ·8 Hot-swap 2.5" NVMe (PCIe5.0 x 4) |drive bays from PCIe switch |·2 Hot-swap 2.5" NVMe (PCIe5.0 x 4)/SATA |drive bays form CPU
Internal Side ·1 M-key (PCIe3.0x2 or SATA 6Gb/s), |supports 2280/22110 form factor[PCH] |·1 M-key (PCIe3.0x4), supports 2280/22110 |form factor[PCH]
Power Supply Type 6+6 CRPS
Output Watt 3002.4W@220-240Vac input |2900W@200-220Vac input
Efficiency 80-PLUS Titanium
AC Input 200-240Vrms, 50/60Hz
System Fan ·29 PWM 80 x 80mm fans |·4 PWM 40 x40mm fans
GPU NVIDIA®HGX B200 8-GPU with NVIDIA® NVSwitch™
CPU Supports 5th and 4th Gen |Intel® Xeon® Scalable Processors
Socket Dual Socket E(LGA4677)
Thermal Design Power Up to 350W
Chipset C741
Supported DIMM Quantity 16+16 DIMM slots (2DPC)
Max Capacity per DIMM ·RDIMM:96GB |·RDIMM-3DS:2H-128GB/4H-256GB
PCIe x16 Rear: |·8 HHHL PCIe5.0x16 |·2 FHHL PCIe5.0x16
Additional GbE Controller Intel® i350:2 RJ45 (1GbE)
BMC Controller ASPEED AST2600
IPMI Dedicated Glan ·1 Realtek RTL8211F for dedicated management GLAN
Controller ASPEED AST2600
VRAM DDR4 512MB
UID Button/LED 1 UID button
VGA Port 1 DB15 (VGA)
USB32 Gen1 Port 2 Type-A (USB32 Gen1)
RJ45 ·2 RJ45 (1GbE) by Intel®i350, |share with front panel |·1 Dedicated IPMI shares with front panel
Temperature Monitor ·CPU,MB,card side temperature sensing
Fan ·Fan tachometer |·CPU Quiet Fan (allows chassis fan |speed auto-adjust by CPU temperature) |·Fan multi-speed control

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